发明名称 REMOVING METHOD FOR RESIN BURR OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To remove the resin burr after sealed with resin without damaging a lead frame by removing the resin burr by hydrogen gas generated through electrolysis. CONSTITUTION:When the lead frames 2 are used as cathodes, an electric cell 21 made of stainless steel is employed as anodes and filled with an alkaline aqueous solution as an electrolyte and electrolysis is conducted, hydrogen 23 is generated from the lead frames 2 as the cathodes and oxygen 24 from the stainless plate 21 as the anodes, and the circumference of the lead frames 2 is changed into an alkaline liquid having high concentration. Since epoxy resin is minutely dissolved into alkali having high concentration, clearances are shaped among the resin burr 3 and the lead frames 2, hydrogen gas generated through the electrolysis of the alkaline aqueous solution intruding into the clearances has mechanical action on the resin burr, the burr is exfoliated from the lead frames and the burr is removed.
申请公布号 JPS57188830(A) 申请公布日期 1982.11.19
申请号 JP19810072888 申请日期 1981.05.16
申请人 TOKYO SHIBAURA DENKI KK 发明人 SAKURAI HISAHARU
分类号 H01L21/56;(IPC1-7):01L21/56 主分类号 H01L21/56
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