| 摘要 |
PURPOSE:To prevent a shortcircuit malfunction due to the contact of leads with a metal plate in case of sealing by providing an insulator film on the surface of the metal plate buried in a sealing resin so as to accelerate thermal conduction. CONSTITUTION:A chip 1 is bonded to a die pad 2, the inner ends of leads 3 and a gold wire 4 are electrically connected, a metal plate 5 to accelerate thermal conduction is contacted with the back surface of the pad 2, and sealed with a sealing resin 6. An insulator 7 such as, for example, polyimide resin film is formed on part of the surface (the surface opposed to the leads) of the metal plate 5 for accelerating the thermal conduction. The insulator 7 can be readily performed by a method of coating by a screen printing and hardening, or a method of bonding a filmlike or tapelike insulator of the prescribed thickness. |
