| 摘要 |
PURPOSE:To make it easy to manufacture IC cards by making corresponding respectively to a punching position or more outer position and by accumulating a circuit substrate and a cover sheet with this marking as a standard. CONSTITUTION:A mark M which is arranged in a fixed interval from an outline of the part to be finally punched toward the edge is printed on the surfaces of an original plate 11' of the surface cover sheet, an original plate 12' of the rear cover sheet, an original plate 13' of an IC chip substrate and an original plate 15' of a conductor pattern substrate. The fixed electric connection is formed between the original plates simultaneously with accumulating each original plate in the fixed order. Even mark M of each original plate is put in accord when these original plates are unified by pressing molding. After unifying by press molding, punching is finally executed with the mark M as a standard. |
