发明名称 |
COMPOSITION FOR FIXING METALLIC POWDER MOLDING DURING SINTERING |
摘要 |
PURPOSE:To prevent a metallic powder molding consisting of metallic powder and synthetic resin binder from exfoliating from a base material surface during sintering in the stage of forming a sintered metallic layer on the surface of the metallic base material of said metallic powder molding by using a specifically composed compsn. for fixing. CONSTITUTION:The sheet-shaped metallic molding consisting of <=50 mesh powder of a wear-resistant alloy and resin binder such as acrylic polymer is adhered to the surface of the metallic base material to 0.5-5mm. thickness. The polyimide soln. prepd. by compounding an epoxy compd. having >=2 epoxy groups in one molecule into an org. solvent soln. of the polyimide precursor consisting of the polyamide acid synthesized of aliphat. tetracarboxylic dianhydride and org. diamine or the polyamide acid imide formed by partial conversion to imide thereof in such a way that the epoxy groups are incorporated at >=0.3 equiv. by 1 equiv. acid group of the polyimide precursor is coated and interposed between the base material and metallic powder molding to prevent the metallic powder molding from exfoliating from the metallic base material in the stage of sintering said molding in a non-oxidizing atmosphere.
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申请公布号 |
JPS60230912(A) |
申请公布日期 |
1985.11.16 |
申请号 |
JP19840086965 |
申请日期 |
1984.04.30 |
申请人 |
NITTO DENKI KOGYO KK |
发明人 |
SAKURAMOTO TAKAFUMI;KOJIMA MAKOTO;TOMINAGA TAKASHI;ASOSHINA HIDESHI |
分类号 |
B22F7/04;B22F7/02 |
主分类号 |
B22F7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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