| 摘要 |
<p>The present invention concerns the manufacturing of chipboard wherein as bonding agent is used cross-linking polyethylene powder to which a small amount of peroxide or encapsulated vinyl silane has been added, and which cross-links the polyethylene powder at the pressing stage in the hot press. The polyethylene powder is adhered to the wood chips homogeneously by first adding aqueous adhesive agent to the chips. Mixing is accomplished in a high-speed dry mixer. After the mixing, the wood fibre mix is ready to be pressed in a hot press into boards of suitable thickness.</p> |
