| 摘要 |
PURPOSE:To avoid tab short circuits, to improve the yield rate of semiconductor devices and to improve the reliability of the semiconductor device, by fixing a pellet to a tab, on the entire surface of which an insulating pellet attaching material is applied. CONSTITUTION:A pellet attaching material 3 is applied on the entire surface of a tab 2 which supports and fixes the pellet 1. The pellet attaching material 3 is also applied to the outside of the pellet 1. The pellet attaching material 3 is made of a thermosetting resin, e.g., a polyimide resin. Thus tab short circuits do not occur even if a metal wire 5 is contacted with the metal tab 2.
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