发明名称 |
FIXED-ABRASIVE-GRAIN WIRE, WIRE SAW, AND METHOD FOR SLICING WORKPIECE |
摘要 |
The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece. |
申请公布号 |
SG11201609596T(A) |
申请公布日期 |
2016.12.29 |
申请号 |
SGT11201609596 |
申请日期 |
2015.03.18 |
申请人 |
SHIN-ETSU HANDOTAI CO.,LTD. |
发明人 |
KATO, TADAHIRO |
分类号 |
B24D11/00;B24B27/06;B24D3/00;B28D5/04;H01L21/304 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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