| 摘要 |
PURPOSE:To prepare the title compsn. with a low thermal expansion coefficient, a high thermal conductivity and excellent moisture resistance and moldability by compounding an epoxy resin, a novolao phenol resin, a specific copolymer resin, and a silicon nitride powder surface-treated with a specific silazane compd. CONSTITUTION:The title compsn. is prepd. by compounding 100 pts.wt. resin component comprising an epoxy resin, a novolak phenol resin, and a methyl methacrylate-butadiene-styrene copolymer resin with 25-90 pts.wt. silicon nitride powder having a mean particle diameter of 10-50mum and surface-treated with a silazane compd. of the formula (wherein R is alkyl or phenyl). The compsn. has well-balanced properties, i.e., a low thermal expansion coefficient, a high thermal conductivity, and excellent moisture resistance and moldability, and hence is used for sealing a semiconductor pellet to give a sealed semiconductor device with a high reliability. |
