| 摘要 |
<p>PURPOSE:To divide a semiconductor wafer into each chip accurately and reliably at all times by setting a plurality of diamond-tipped diamond-cutters in an arrayed state in the direction of the movement. CONSTITUTION:The tip angle theta3 of a first diamond-cutter 11 and the tip angle theta4 of a second diamond-cutter 12 are first set to theta3>theta4, and a first scribing line 6a is made on a metal film 5a formed on a semiconductor wafer 4 by the first diamond-cutter 11. Then, a scribing line 6b is made by the second diamond-cutter 12 in the same position as the first scribing line 6a. In this instance, since the tip angle of the first diamond-cutter 11 and that of the second diamond-cutter 12 are set to theta3>theta4, and because the thickness of the metal film 5a has already become thin owing to the first scribing line 6a, strain 7 can be put into the semiconductor wafer 4 by making the second scribing line 6b.</p> |
