发明名称 PACKAGE TRIM APPARATUS
摘要 The IC package trim machine, a device that can trim a number of packages with one revolution, comprises die (2) which is set on the middle of base (1) and has square irregularities, a large number of upper rails (3-1,3-2,...,3-n) and lower rails (4-1,4- 2,..., 4-n) fixed an both ends of the die (1), a couple of cams set between the square irregularities, and cam operating bars (11-1,11- 2,...,11-n).
申请公布号 KR930009423(B1) 申请公布日期 1993.10.04
申请号 KR19900019645 申请日期 1990.11.30
申请人 HYUNDAI ELECTRONICS CO., LTD. 发明人 KIM, KANG - SAN
分类号 H01L21/68;H01L23/50;(IPC1-7):H01L21/68 主分类号 H01L21/68
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