发明名称 |
CHEMICAL MECHANICAL POLISHING SYSTEM |
摘要 |
The present invention relates to a chemical mechanical polishing system comprising: a memory for storing control data for the components of a chemical mechanical polishing device; and the chemical mechanical polishing device controlled by calling control data from used component information from the memory. The chemical mechanical polishing system can stably maintain the quality of the wafer polished by the chemical mechanical polishing device all the time to obtain reliable polishing quality, by storing the control data for the components of the chemical mechanical polishing device in the memory in advance, and controlling the chemical mechanical polishing device by calling the control data stored in the memory in accordance with the state of the components or a usage period. |
申请公布号 |
KR20160103791(A) |
申请公布日期 |
2016.09.02 |
申请号 |
KR20150026609 |
申请日期 |
2015.02.25 |
申请人 |
K.C.TECH CO., LTD. |
发明人 |
CHO, HYUN GI;CHOI, GWANG RAK |
分类号 |
H01L21/304;H01L21/02;H01L21/321 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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