| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer mapping method for smoothly implementing dicing by highly accurately measuring warpage or swell around a semiconductor wafer beforehand as a preparation step of cutting a semiconductor wafer and manufacturing a semiconductor chip in a semiconductor manufacturing device.SOLUTION: The semiconductor wafer mapping method in a laser processing machine for manufacturing a semiconductor chip by longitudinally and laterally cutting a semiconductor wafer S formed by longitudinally and laterally aligning predetermined circuits includes: sucking and holding the semiconductor wafer S on a movable table 12; irradiating a surface of the semiconductor wafer S with laser light; detecting reflection light reflected on the surface of the semiconductor wafer S to measure a surface height of the semiconductor wafer S; moving the movable table 12 in X and Y directions; and forming a trajectory line 19 of a measurement position on the surface of the semiconductor wafer S along an outer circumference S1 of the semiconductor wafer S to acquire a data map in the surface height of the semiconductor wafer S. |
