发明名称 PHOTOSENSITIVE COMPOSITION, METHOD FOR PREPARING SAME, PHOTOSENSITIVE FILM, PHOTOSENSITIVE LAMINATE, PERMANENT PATTERN FORMING METHOD, AND PRINTED CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition having a long pot life, excellent in tackiness, plane trouble, surface shape and edge roughness, having high sensitivity, high resolution, excellent resistance to electroless gold plating and excellent property of filling via and through holes, and capable of efficiently forming high-definition permanent patterns (such as a protective film, an interlayer insulation film and a solder resist pattern), by specifying a binder and a heat crosslinking agent used together with the binder, and to provide a method for preparing the photosensitive composition, a photosensitive film, a photosensitive laminate, a permanent pattern forming method using the photosensitive laminate, and a printed circuit board on which a permanent pattern is formed by the permanent pattern forming method. <P>SOLUTION: The photosensitive composition comprises a binder, a polymerizable compound, a photopolymerization initiator, a pigment and a heat crosslinking agent and has an average particle diameter of particles being &le;2 &mu;m. There are also provided the method for preparing the photosensitive composition, the photosensitive film, the photosensitive laminate, the permanent pattern forming method using the photosensitive laminate, and the printed circuit board on which a permanent pattern is formed by the permanent pattern forming method. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007322755(A) 申请公布日期 2007.12.13
申请号 JP20060153033 申请日期 2006.06.01
申请人 FUJIFILM CORP 发明人 TAKASHIMA MASANOBU;HAYASHI TOSHIAKI
分类号 G03F7/004;G03F7/027;G03F7/038;H05K3/00 主分类号 G03F7/004
代理机构 代理人
主权项
地址