发明名称 |
METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE |
摘要 |
A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded. |
申请公布号 |
EP2966679(A4) |
申请公布日期 |
2016.12.07 |
申请号 |
EP20140760896 |
申请日期 |
2014.02.28 |
申请人 |
Mitsubishi Materials Corporation |
发明人 |
OOHIRAKI, Tomoya;OI, Sotaro;NISHIKAWA, Kimihito;HAYASHI, Hiromasa |
分类号 |
H01L23/12;B23K1/00;B23K31/02;C04B35/645;C04B37/02;H01L21/48;H01L23/373;H05K1/02;H05K3/00;H05K3/20 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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