Spring contact for semiconductor chip

摘要

A semiconductor assembly is described. In accordance with one example of the invention, the semiconductor assembly comprises a semiconductor body, a top main electrode arranged on a top side, a bottom main electrode arranged on an underside, and a control electrode arranged on the top side. The semiconductor assembly further includes a spring element for the pressure contacting of the control electrode with a pressure force generated by the spring element.

主权项

1. A semiconductor assembly comprising:
a semiconductor body having a top side and an underside opposite the top side; a top main electrode arranged on the top side; a bottom main electrode arranged on the underside; a control electrode arranged at the top side, by means of which control electrode an electric current between the top main electrode and the bottom main electrode can be controlled; a spring element that pressure contacts the control electrode with a pressure force generated by the spring element, wherein the spring element is electrically and mechanically connected to the control electrode, such that the pressure force acts on the semiconductor assembly, inter alia; and a body composed of molding compound in which the semiconductor body is embedded.