Hexagonal boron nitride heat dissipation structure

摘要

A hexagonal boron nitride heat dissipation structure includes a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element. Each electronic component is configured to generate heat, each thermally conductive buffer layer is made of hBN that has thermal conductivity range from 10 to 40 W/mK. Such structure can completely overcome the issue of short circuit of electronic devices. The cooling of modern electronic devices, which has limited space for cooling, can be improved by this simple structure that takes full advantage of hBN and other heat dissipation materials.

主权项

1. A hexagonal boron nitride heat dissipation structure comprising: a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element;
wherein said each electronic component is fixed onto said thermally conductive buffer layer; wherein each thermally conductive buffer layer is made of hexagonal boron nitride with thermal conductivity ranging from 10 to 40 W/mk, and a total thickness of said each layer is at least larger than 0.01 mm with robust strength so as to hold the electronics; and wherein the electronic conductive heat dissipation element C is metal skin or is made in a heat dissipation coating manner.