发明名称 METHOD OF MANUFACTURING PIEZOELECTRIC ELEMENT
摘要 A method of manufacturing a piezoelectric element provided with first electrodes, a piezoelectric body layer, and a second electrode including a first platinum layer and second platinum layer, in which the first platinum layer having compression stress is formed on the piezoelectric body layer, which is provided on the first electrodes, using a sputtering technique, and the second platinum layer having tensile stress, is formed on the first platinum layer using a sputtering technique with a lower sputtering power than that when the first platinum layer is formed.
申请公布号 US2017067143(A1) 申请公布日期 2017.03.09
申请号 US201615258475 申请日期 2016.09.07
申请人 SEIKO EPSON CORPORATION 发明人 NAKAYAMA Masao;HIRAI Eiju;SHIMIZU Toshihiro;TAKABE Motoki;OSAWA Eiji
分类号 C23C14/18;H01L41/277;B41J2/16;C23C14/58;C22F1/14;C22F1/18;H01L41/29;C23C14/34 主分类号 C23C14/18
代理机构 代理人
主权项 1. A method of manufacturing a piezoelectric element, which is provided with first electrodes, a piezoelectric body layer, and a second electrode including a first platinum layer and a second platinum layer, in which the first electrodes are individual electrodes that are respectively provided in an electrically independent manner for active sections, and in which the second electrode is a common electrode that is provided in an electrically common manner throughout the active sections, the method comprising: forming the first platinum layer having compression stress or tensile stress on the piezoelectric body layer, which is provided on the first electrodes, using a sputtering technique; and forming the second platinum layer having tensile stress or compression stress, on the first platinum layer using a sputtering technique with a sputtering power that differs from that during formation of the first platinum layer.
地址 Tokyo JP