WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNAS AND AIR CAVITY

摘要

Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

主权项

1. An antenna package, comprising:
a package carrier comprising an antenna ground plane and an antenna feed line; and a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid; wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier; wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier; and wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of the package carrier using a second array of solder hump connections.