| 发明名称 |
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE |
| 摘要 |
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound. |
| 申请公布号 |
US2017121505(A1) |
申请公布日期 |
2017.05.04 |
| 申请号 |
US201715404224 |
申请日期 |
2017.01.12 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Hamada Mitsuyoshi;Furusawa Fumio;Ikezawa Ryoichi;Takemiya Keizo;Baba Toru |
| 分类号 |
C08K7/18;C09K3/10;H01L23/29 |
主分类号 |
C08K7/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxysilane compound. |
| 地址 |
Tokyo JP |
