Semiconductor packages

摘要

Semiconductor packages are provided. A semiconductor package may include an embedding substrate including a cavity therein and a connection window in a bottom portion of the cavity. The semiconductor package may include a semiconductor chip disposed in the cavity and coupled to chip connectors, the chip connectors of the semiconductor chip inserted into the connection window. The semiconductor package may include a dielectric layer filling the cavity and the connection window and configured to expose end portions of the chip connectors and to substantially cover the semiconductor chip. Related memory cards and related electronic systems are also provided.

主权项

1. A semiconductor package comprising:
an embedding substrate including a cavity opened at a first surface of the embedding substrate and including a connection window penetrating a bottom portion of the cavity opening a second surface of the embedding substrate, the second surface of the embedding substrate opposite to the first surface; a first semiconductor chip disposed in the cavity and coupled to first chip connectors, the first chip connectors of the first semiconductor chip inserted into the connection window; a dielectric layer filling the cavity and the connection window to expose end portions of the first chip connectors and covering the first semiconductor chip; and a second semiconductor chip disposed on the second surface of the embedding substrate and coupled to second chip connectors, the second chip connectors of the second semiconductor chip connected to at least one of the first chip connectors, wherein the cavity is configured to be recessed toward the second surface.