SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR MODULE

摘要

A semiconductor package, a semiconductor module, a method of fabricating a semiconductor package are disclosed. The semiconductor package may include a substrate, a semiconductor chip, a connection terminal, a mold layer, and a protection layer. The protection layer may be provided to cover the substrate, the connection terminal, and the mold layer. The protection layer may be removed from a lower portion of the connection terminal, and thus, the lower portion of the connection terminal may be exposed. The connection terminal may be coupled to a module substrate through the lower portion, and a result, the semiconductor module may be fabricated. The connection terminal, the substrate, and the mold layer may be prevented from being exposed to outer air or moisture, owing to the presence of the protection layer.

主权项

1. A semiconductor package, comprising:
a first substrate having first and second surfaces facing each other; a first semiconductor chip provided on the first surface of the first substrate; a connection terminal provided on the second surface of the first substrate, the connection terminal having a first surface facing toward the second surface of the first substrate and a second surface facing away from the first substrate and that extends from one end of the first surface of the connection terminal to an opposite end of the first surface of the connection terminal, wherein the second surface of the connection terminal protrudes away from the second surface of the first substrate; and a protection layer covering the second surface of the first substrate and the entire second surface of the connection terminal.