Package structures and methods of forming the same

摘要

Package structures and methods of forming the same are disclosed. A package structure includes a die, a dielectric layer, an encapsulant and a plurality of supports. The die includes, over a first side thereof, a plurality of connectors. The dielectric layer is formed over the first side of the die aside the connectors. The encapsulant is aside the die. The supports penetrate through the dielectric layer. The grinding rate of the supports is substantially the same as that of the encapsulant but different from that of the dielectric layer.

主权项

1. A package structure, comprising:
a die comprising a connector; a dielectric layer over the die and aside the connector; an encapsulant aside the die; and a plurality of supports in the dielectric layer aside the connector, wherein a material of the support is substantially the same as a material of the encapsulant but different from a material of the dielectric layer, wherein a total of top areas of the supports is about 30 to 70 percent of a total top area of the die.