发明名称 Process of Producing Electronic Component and an Electronic Component
摘要 Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate.
申请公布号 US2017105287(A1) 申请公布日期 2017.04.13
申请号 US201514881034 申请日期 2015.10.12
申请人 Tyco Electronics Corporation 发明人 Oar Michael A.;Soneja Shallu;Gulsoy Gokce
分类号 H05K3/32;H05K1/09 主分类号 H05K3/32
代理机构 代理人
主权项 1. A process of producing a component, the process comprising: positioning a substrate having a non-planar surface; applying a metalizing material on the surface; and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component.
地址 Berwyn PA US