发明名称 |
Process of Producing Electronic Component and an Electronic Component |
摘要 |
Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate. |
申请公布号 |
US2017105287(A1) |
申请公布日期 |
2017.04.13 |
申请号 |
US201514881034 |
申请日期 |
2015.10.12 |
申请人 |
Tyco Electronics Corporation |
发明人 |
Oar Michael A.;Soneja Shallu;Gulsoy Gokce |
分类号 |
H05K3/32;H05K1/09 |
主分类号 |
H05K3/32 |
代理机构 |
|
代理人 |
|
主权项 |
1. A process of producing a component, the process comprising:
positioning a substrate having a non-planar surface; applying a metalizing material on the surface; and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. |
地址 |
Berwyn PA US |