Ultraviolet Device Encapsulant

摘要

A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at least one filler material incorporated in the matrix material that are both at least partially transparent to ultraviolet radiation of a target wavelength. The filler material includes microparticles and/or nanoparticles and can have a thermal coefficient of expansion significantly smaller than a thermal coefficient of expansion of the matrix material for relevant atmospheric conditions. The relevant atmospheric conditions can include a temperature and a pressure present during each of: a curing and a cool down process for fabrication of a device package including the composite material and normal operation of the ultraviolet device within the device package.

主权项

1. A device package, comprising:
an ultraviolet device for which operation involves ultraviolet radiation of a target wavelength; and an encapsulant located adjacent to at least one surface of the ultraviolet device, wherein the encapsulant is a composite material including:
a matrix material at least partially transparent to ultraviolet radiation of the target wavelength and having a matrix material thermal coefficient of expansion; andat least one filler material at least partially transparent to the ultraviolet radiation incorporated in the matrix material, wherein the at least one filler material includes a combination of microparticles and nanoparticles and has a filler thermal coefficient of expansion at least three times smaller than the matrix material thermal coefficient of expansion for atmospheric conditions present during a curing and a cool down process for fabrication of the device package, and wherein a concentration of the at least one filler material in the composite material exceeds a percolation threshold for the filler material.