PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES

摘要

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member, a first die attached to the support member, and a second die attached to the first die in a stacked configuration. The device can also include an attachment feature between the first and second dies. The attachment feature can be composed of a dielectric adhesive material. The attachment feature includes (a) a single, unitary structure covering at least approximately all of the back side of the second die, and (b) a plurality of interconnect structures electrically coupled to internal active features of both the first die and the second die.

主权项

1. An assembly, comprising:
a microelectronic die comprising a substrate having an active side and a back side opposite the active side, integrated circuitry, and a plurality of connectors electrically coupled to the integrated circuitry, wherein the individual connectors include a terminal at the active side of the substrate and an electrically conductive through-substrate interconnect in contact with the terminal and extending completely through the substrate to a terminus at the back side of the substrate; and a connection structure attached to the back side of the substrate, wherein the connection structure comprises— an at least initially generally flexible film having a plurality of preformed openings at least partially aligned with the portions of the through-substrate interconnects accessible at the back side of the substrate; and conductive couplers in the openings and in contact with the corresponding accessible portions of the through-substrate interconnects.