发明名称 METHOD OF FORMING PACKAGED LENS MODULES
摘要 A method of forming packaged lens modules is disclosed which includes: securing first ends of a plurality of lens modules equidistantly on a first mold plate; providing a second mold plate matching with second ends of the lens modules and securing the second mold plate on the second ends of the lens modules; filling a black material in gaps between the lens modules; and removing the first and second mold plates after the black material is cured and performing a dicing process. The method can effectively block lens openings to protect lenses from being contaminated and can eliminate the need for adhesive application and removal generally performed on second ends of the lens modules, thereby resulting in time savings and an efficiency improvement. Additionally, a height of the resulting packaged lens modules can be modified for back focal length compensation thereof by changing the size of the second mold plate.
申请公布号 US2017087755(A1) 申请公布日期 2017.03.30
申请号 US201514869578 申请日期 2015.09.29
申请人 Fan Regis 发明人 Fan Regis
分类号 B29C45/16;G02B7/20;B29D11/00;G02B13/00 主分类号 B29C45/16
代理机构 代理人
主权项 1. A method of forming packaged lens modules, comprising the steps of: step S01: securing first ends of a plurality of lens modules equidistantly on a first mold plate; step S02: providing a second mold plate matching with second ends of the plurality of lens modules and securing the second mold plate on the second ends of the plurality of lens modules; step S03: filling a black material in gaps between the plurality of lens modules; and step S04: removing the first and second mold plates after the black material is cured.
地址 Shanghai CN