发明名称 Semiconductor Module
摘要 Semiconductor module has a first member, a second member, a conductor column extending in the vertical direction between the first member and the second member and a sealing resin covering a first conductor layer and a first power device of the first member, a second conductor layer and a second power device of the second member and the conductor column. Positions of the first power device and the second power device on the horizontal plane are shifted, the second conductor layer is not provided in the vertical direction from a first connection part connected to the first power device, and the first conductor layer is not provided in the vertical direction from a second connection part, connected to the second power device, of the second power device.
申请公布号 US2017092568(A1) 申请公布日期 2017.03.30
申请号 US201514902548 申请日期 2015.04.28
申请人 SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. 发明人 IKEDA Kosuke
分类号 H01L23/495;H01L23/367;H01L23/31 主分类号 H01L23/495
代理机构 代理人
主权项 1. Semiconductor module comprising: a first member having a first insulating substrate, a first conductor layer provided on a mounting surface of the first insulating substrate, a first power device provided to the first conductor layer and a first connection part connected the first power device; a second member having a second insulating substrate, a second conductor layer provided on a mounting surface of the second insulating substrate, a second power device provided to the second conductor layer and a second connection part connected the second power device; a conductor column extending in the vertical direction between the first member and the second member; and a sealing resin covering the first conductor layer, the first power device, the second conductor layer, the second power device and the conductor column; wherein the first power device and the second power device are disposed opposite to each other and connected to each other via the conductor column, wherein positions of the first power device and the second power device on the horizontal plane are shifted, wherein the second conductor layer is not provided in the vertical direction from the first connection part and wherein the first conductor layer is not provided in the vertical direction from the second connection part.
地址 Tokyo JP