ULTRASONIC POLISHING SYSTEMS AND METHODS OF POLISHING BRITTLE COMPONENTS FOR ELECTRONIC DEVICES

摘要

Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.

主权项

1. An ultrasonic polishing system for polishing a non-planar feature formed in a brittle component, the system comprising:
an ultrasonic driver; a polishing head operatively coupled to the ultrasonic driver and having a surface shape that corresponds to the non-planar feature formed in the brittle component; and an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head; wherein the ultrasonic driver is configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.