| 摘要 |
A chip antenna 1 equipped with an antenna pattern 3 obtained by folding a conductive plate in a three-dimensional shape, and a resin substrate 2 that holds the antenna pattern 3 on the surface thereof, wherein: the substrate 2 has an engagement part 27 integrally formed thereon that engages the surface of the antenna pattern 3 in the thickness direction of the conductive plate; and the engagement part 27 is provided along the edge section of the antenna pattern 3. |
