MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT PACKAGES

摘要

A method for making an integrated circuit package includes providing a handle wafer having a first region defining a cavity. A capacitor is formed in the first region. The capacitor has a pair of electrodes, each coupled to one of a pair of conductive pads, at least one of which is disposed on a lower surface of the handle wafer. An interposer having an upper surface with a conductive pad and at least one semiconductor die disposed thereon is also provided. The die has an integrated circuit that is electroconductively coupled to a redistribution layer (RDL) of the interposer. The lower surface of the handle wafer is bonded to the upper surface of the interposer such that the die is disposed below or within the cavity and the electroconductive pad of the handle wafer is bonded to the electroconductive pad of the interposer in a metal-to-metal bond.

主权项

1. An integrated circuit package comprising a first substrate and a second substrate bonded to the first substrate, with a plurality of cavities enclosed by the first and second substrates, the plurality of cavities comprising one or more first cavities and one or more second cavities;
wherein the second substrate comprises circuitry with first electroconductive pads in the first and second cavities, each of the first and second cavities having at least one first electroconductive pad therein; and wherein the integrated circuit package further comprises: in each first cavity, at least one semiconductor die comprising an integrated circuit electroconductively coupled to at least one first electroconductive pad in the first cavity; and in each second cavity, at least one discrete electrical component electroconductively coupled to at least one first electroconductive pad in the second cavity and comprising a conductive layer such that at least one of the following is true: (i) the conductive layer is formed over a surface of the first substrate in the second cavity; (ii) the conductive layer comprises at least a part of the surface of the first substrate in the second cavity.