Power semiconductor module and power module

摘要

An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided.;An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.

主权项

1. A power semiconductor module comprising: a semiconductor device;
a conductor plate having a first surface on which the semiconductor device is mounted; a resin sealer that covers a side portion of the conductor plate and exposes at least part of the a second surface of the conductor plate that faces away from the first surface; and a spray coated film provided on an outer surface of the resin sealer and the at least part of the second surface of the conductor plate that is exposed through the resin sealer, and a recess is formed in the outer surface of the resin sealer, and the planar size of the recess is greater than the planar size of each flat portion that forms the spray coated film; wherein the spray coated film is continuously disposed on the outer surface of the resin sealer, in the recess, and on the at least part of the second surface of the conductor plate that is exposed through the resin sealer, without interruption.