发明名称 表面実装インダクタおよびその製造方法
摘要 PROBLEM TO BE SOLVED: To provide a surface mounting inductor not having the risk of falling out of a metal terminal, and capable of suppressing positional deviation of the winding terminal due to springback thereof, before connecting the winding terminal and metal terminal electrically, and disconnection the winding terminal and metal terminal due to remelting of solder at the time of mounting a substrate.SOLUTION: In a surface mounting inductor 10 where a winding 40 obtained by winding an insulation coated conductor is sandwiched by a plurality of temporary moldings 20, 30 molded temporarily into a predetermined shape by kneading magnetic material powder and thermosetting resin, and then hot pressed, a pair of metal terminals 50a, 50b having a stair-like step are arranged on the exterior of the surface mounting inductor 10, while being embedded in the thickness direction, and the terminals 41a, 41b of the winding are pulled out from the bottom surface of the surface mounting inductor 10, bent at the root, and arranged along the step.SELECTED DRAWING: Figure 1
申请公布号 JP6086113(B2) 申请公布日期 2017.03.01
申请号 JP20140258142 申请日期 2014.12.20
申请人 株式会社村田製作所 发明人 新井 工;大羽賀 健生;水越 泰孝;渡辺 亮太
分类号 H01F27/29;H01F27/28;H01F41/04;H01F41/10 主分类号 H01F27/29
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