发明名称 HEAT SINK
摘要 A heat sink assembly is provided herein. The heat sink assembly includes at least two heat sinks, a mechanical support member, and a flexible heat pipe. Each of the at least two heat sinks are formed to mate with one of at least two processors. The mechanical support member are formed to mechanically engage with the at least two heat sinks. The flexible heat pipe connects to the at least two heat sinks to provide a thermal link therebetween
申请公布号 EP3025568(A4) 申请公布日期 2017.03.01
申请号 EP20130890131 申请日期 2013.07.22
申请人 Hewlett Packard Enterprise Development LP 发明人 NORTON, John
分类号 H01L23/427;H01L23/367;H05K7/20 主分类号 H01L23/427
代理机构 代理人
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