Advanced grounding scheme

摘要

A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug.

主权项

1. An apparatus comprising:
a laminate core having a first cavity; a slug having a first side and a second side opposite the first side of the slug, wherein the slug is positioned within the first cavity of the laminate core and coupled with the laminate core via an adhesive; a capping layer having a first side directly coupled with the first side of the slug and a second side that is opposite the first side of the capping layer, wherein the capping layer is electronically conductive; a first dielectric having a first side coupled with the second side of the capping layer and a second side opposite the first side of the first dielectric; a routing layer having a first side coupled with the second side of the first dielectric and a second side opposite the first side of the routing layer, wherein the routing layer is electronically conductive; and a second cavity in the first dielectric and the routing layer, and a plated element positioned within the second cavity, wherein the plated element has a first side that is directly coupled with the second side of the capping layer and a second side opposite the first side of the plated element.