发明名称 |
High-throughput fluorescence imaging system and device with sample heating capability, and associated methods |
摘要 |
A high-throughput fluorescence imaging system with sample heating capability includes an image sensor wafer with a plurality of image sensors for fluorescence imaging a plurality of samples disposed in a respective plurality of fluidic channels on the image sensor wafer. The high-throughput fluorescence imaging system further includes a heating module, thermally coupled with the image sensor wafer, for heating the samples. A method for high-throughput assay processing includes modulating temperature of a plurality of samples disposed in a respective plurality of fluidic channels on an image sensor wafer by heating the image sensor wafer, using a heating module thermally coupled with the image sensor wafer, to control reaction dynamics in the samples; and capturing a plurality of fluorescence images of the samples, using a respective plurality of image sensors of the image sensor wafer, to detect one or more components of the plurality of samples. |
申请公布号 |
US9574991(B2) |
申请公布日期 |
2017.02.21 |
申请号 |
US201414513985 |
申请日期 |
2014.10.14 |
申请人 |
OmniVision Technologies, Inc. |
发明人 |
Zhang Bowei |
分类号 |
C12Q1/68;G01N21/03;G01N21/64;B01L3/00;B01L7/00;G01J3/44;G01N21/17 |
主分类号 |
C12Q1/68 |
代理机构 |
Lathrop & Gage LLP |
代理人 |
Lathrop & Gage LLP |
主权项 |
1. A high-throughput fluorescence imaging system with sample heating capability, comprising:
an image sensor wafer including a plurality of image sensors for fluorescence imaging a plurality of samples disposed on the image sensor wafer; a fluidic wafer having recesses that cooperate with the image sensor wafer to form a plurality of fluidic channels for respectively containing the samples on the image sensor wafer; and a heating module, thermally coupled with the image sensor wafer, for heating the samples. |
地址 |
Santa Clara CA US |