发明名称 High-throughput fluorescence imaging system and device with sample heating capability, and associated methods
摘要 A high-throughput fluorescence imaging system with sample heating capability includes an image sensor wafer with a plurality of image sensors for fluorescence imaging a plurality of samples disposed in a respective plurality of fluidic channels on the image sensor wafer. The high-throughput fluorescence imaging system further includes a heating module, thermally coupled with the image sensor wafer, for heating the samples. A method for high-throughput assay processing includes modulating temperature of a plurality of samples disposed in a respective plurality of fluidic channels on an image sensor wafer by heating the image sensor wafer, using a heating module thermally coupled with the image sensor wafer, to control reaction dynamics in the samples; and capturing a plurality of fluorescence images of the samples, using a respective plurality of image sensors of the image sensor wafer, to detect one or more components of the plurality of samples.
申请公布号 US9574991(B2) 申请公布日期 2017.02.21
申请号 US201414513985 申请日期 2014.10.14
申请人 OmniVision Technologies, Inc. 发明人 Zhang Bowei
分类号 C12Q1/68;G01N21/03;G01N21/64;B01L3/00;B01L7/00;G01J3/44;G01N21/17 主分类号 C12Q1/68
代理机构 Lathrop & Gage LLP 代理人 Lathrop & Gage LLP
主权项 1. A high-throughput fluorescence imaging system with sample heating capability, comprising: an image sensor wafer including a plurality of image sensors for fluorescence imaging a plurality of samples disposed on the image sensor wafer; a fluidic wafer having recesses that cooperate with the image sensor wafer to form a plurality of fluidic channels for respectively containing the samples on the image sensor wafer; and a heating module, thermally coupled with the image sensor wafer, for heating the samples.
地址 Santa Clara CA US