| 摘要 |
The invention relates to a conductor-structure element comprising an internal layer substrate (20, 20', 20'') laminated into a layer formation, and having a component side (32) provided with at least one first component (30) and an opposing side (28) pointing towards an edge layer formed by a rigid carrier (12), wherein the internal layer structure (20) is surrounded by resin material up to an edge region about an exposed recess (50) in the rigid carrier (12). |
