Semiconductor package, module substrate and semiconductor package module having the same

摘要

Semiconductor packages, module substrates and semiconductor package modules having the same are provided. The semiconductor package module includes a module substrate provided with a plurality of signal wires on an upper surface thereof, a package substrate disposed on the module substrate, a semiconductor chip disposed on one surface of the package substrate, and a plurality of external connection terminals disposed on another surface of the package substrate.

主权项

1. A semiconductor package module, comprising:
a module substrate provided with a plurality of signal wires on an upper surface thereof; a package substrate disposed on the module substrate, the package substrate including a first surface, and a second surface opposite to the first surface; a semiconductor chip disposed on the first surface of the package substrate; and a plurality of external connection terminals disposed on the second surface of the package substrate, the external connection terminals being electrically connected to the semiconductor chip by metal wiring layers through the package substrate, wherein the second surface of the package substrate includes a plurality of terminal disposition portions and a plurality of non-terminal portions, each of the plurality of external connection terminals is disposed in a corresponding terminal disposition portion among the plurality of terminal disposition portions and connected to a corresponding signal wire among the plurality of signal wires, the plurality of non-terminal portions are disposed adjacent to an edge of the package substrate, and are disposed spaced apart from each other at equal intervals, at least two among the plurality of terminal disposition portions are disposed between the non-terminal portions, and at least two of the plurality of signal wires pass under a corresponding one of the plurality of non-terminal portions, wherein the plurality of terminal disposition portions and the plurality of non-terminal portions form an array, the plurality of external connection terminals are disposed in an area defined by three columns of the array that are located adjacent to the edge of the package substrate, and the area defined by the three columns of the array that are located adjacent to the edge of the package substrate includes a plurality of differential signal areas, and each of the plurality of differential signal areas includes eight among the plurality of terminal disposition portions and one among the plurality of non-terminal portions.