INTERCONNECT ROUTING CONFIGURATIONS AND ASSOCIATED TECHNIQUES

摘要

Embodiments of the present disclosure are directed toward interconnect routing configurations and associated techniques. In one embodiment, an apparatus includes a substrate, a first routing layer disposed on the substrate and having a first plurality of traces, and a second routing layer disposed directly adjacent to the first routing layer and having a second plurality of traces, wherein a first trace of the first plurality of traces has a width that is greater than a width of a second trace of the second plurality of traces. Other embodiments may be described and/or claimed.

主权项

1. An apparatus comprising:
a substrate; a first routing layer disposed on the substrate and having a first plurality of traces, wherein a first ground trace of the first plurality of traces has a first width as measured in a direction parallel to a face of the substrate, and a first signal trace of the first plurality of traces has a second width as measured in the direction parallel to the face of the substrate; and a second routing layer disposed directly adjacent to the first routing layer and having a second plurality of traces, wherein a second ground trace of the second plurality of traces has the first width, and a second signal trace of the second plurality of traces has the second width.