| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry film having a resin layer which is excellent in peelability from a carrier film, and suppresses cracking and falling of powder, and a printed wiring board provided with a cured product obtained by curing the dry film.SOLUTION: A dry film has a resin layer containing a thermosetting resin component, a filler, and at least two solvents. At least two solvents have boiling points of 100°C or higher, have boiling points different by 5°C or more from one another, and contain at least one of triazine derivatives, a cyanate ester resin, and an active ester resin. |
