Electronic and optical co-packaging of coherent transceiver

摘要

Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.

主权项

1. A co-packaged electronic and optical apparatus comprising:
a package substrate body; a chip comprising a driver and/or transimpedance amplifier (TIA), the chip being attached to the package substrate body; an application specific integrated circuit (ASIC) attached to and in electrical communication with the chip; a photonic integrated circuit (PIC) adjacent to and in electrical communication with the chip, the PIC having a surface; a single-piece mast positioned adjacent to the PIC; and an optical fiber coiled around the single-piece mast and having an end terminating substantially perpendicularly on the surface of the PIC.