发明名称 Use of compositions comprising a surfactant and a hydrophobizer for avoiding anti pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below
摘要 In a method of treating a substrate including patterns having line-space dimensions of 50 nm or below, the substrate is rinsed by an aqueous composition including at least one non-ionic surfactant A and at least one hydrophobizer B. The at least one surfactant A has an equilibrium surface tension of 10 mN/m to 35 mN/m, determined from a solution of the at least one surfactant A in water at the critical micelle concentration. The hydrophobizer B is selected so that the contact angle of water to the substrate is increased by contacting the substrate with a solution of the hydrophobizer B in water by 5-95° compared to the contact angle of water to the substrate before such contacting.
申请公布号 US9557652(B2) 申请公布日期 2017.01.31
申请号 US201314652120 申请日期 2013.12.04
申请人 BASF SE 发明人 Klipp Andreas;Honciuc Andrei;Oetter Günter;Bittner Christian
分类号 G03F7/42;H01L21/02;H01L21/027;C11D1/835;C11D1/94;C11D11/00;G03F7/20;G03F7/40 主分类号 G03F7/42
代理机构 Armstrong Teasdale LLP 代理人 Armstrong Teasdale LLP
主权项 1. A method for treating a substrate including patterns having line-space dimensions of 50 nm or below, the method comprising rinsing the substrate with an aqueous composition comprising at least one non-ionic surfactant A and at least one hydrophobizer B, wherein (a) the at least one surfactant A has an equilibrium surface tension of 10 mN/m to 35 mN/m, determined from a solution of the at least one surfactant A in water at the critical micelle concentration, and (b) the at least one hydrophobizer B is selected so that the contact angle of water to the substrate is increased by contacting the substrate with a solution of the hydrophobizer B in water by 5-95° compared to the contact angle of water to the substrate before such contacting.
地址 Ludwigshafen DE
您可能感兴趣的专利