发明名称 樹脂多層基板および樹脂多層基板の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin multilayer substrate which is also available even for the purpose to which severe characteristic setting is required, by making characteristic variance hard to occur even when a bent portion and a flat portion are formed by heating/bending the resin multilayer substrate.SOLUTION: The manufacturing method of a resin multilayer substrate includes a heating/bending step of forming a flat portion and a bent portion through heating/bending using a die on a laminate in which a circuit pattern is provided by laminating a plurality of thermoplastic resin layers. In the heating/bending step, the laminate is bent via an interposition member which makes heat conductivity between the die and the flat portion lower than heat conductivity between the die and the bent portion.
申请公布号 JP6065707(B2) 申请公布日期 2017.01.25
申请号 JP20130067421 申请日期 2013.03.27
申请人 株式会社村田製作所 发明人 池田 直徒
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
代理机构 代理人
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