| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which makes the sealability for a space of the electronic component preferable and achieves downsizing and thickness reduction.SOLUTION: An electronic component 1 comprises: a first wiring board 3; a second wiring board 4 having a second conductor layer 4b; and an electronic element 2 composed of a function body 2b provided on an element substrate 2a, wiring 2c extending from the function body 2b to the outer periphery side of the element substrate 2a, and an element pad 2d provided at a position corresponding to the second conductor layer 4b. The electronic element 2 includes: an insulation layer 5 which is provided so as to expose a part of the element pad 2 and enclose the function body 2b; and a conductive joint material 6 which is provided on the element pad 2 exposed from the insulation layer 5. The conductive joint material 6 and the second conductor layer 4b are electrically connected. |
