| 摘要 |
A die identification circuit for a semiconductor memory device is provided to perform die identification accurately and rapidly by reducing loading of a die identification signal generated by a fuse. According to a die identification circuit for identifying a memory die at a wafer state, a decoder part(10) generates pulse signals enabled sequentially by decoding a column address counted according to a burst mode. A number of die identification fuse parts(20) transmit die identification information according to fuse cut in correspondence to each pulse signal. An output part(30) latches the die identification signal transmitted from each die identification fuse part and then outputs the latched die identification information as a die identification signal.
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