发明名称 DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES
摘要 In some embodiments, a system may include an integrated circuit. The integrated circuit may include a substrate including a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface. The first set of electrical conductors may function to electrically connect the integrated circuit to a circuit board. The integrated circuit may include a semiconductor die coupled to the second surface of the substrate using a second set of electrical conductors. The integrated circuit may include a passive device dimensioned to be integrated with the integrated circuit. The passive device may be positioned between the second surface and at least one of the first set of electrical conductors. The die may be electrically connected to a second side of the passive device. A first side of the passive device may be available to be electrically connected to a second device.
申请公布号 US2017018546(A1) 申请公布日期 2017.01.19
申请号 US201615057588 申请日期 2016.03.01
申请人 Apple Inc. 发明人 Zhai Jun;Ramachandran Vidhya;Hu Kunzhong;Pang Mengzhi;Zhong Chonghua
分类号 H01L27/06;H01L49/02;H01L21/77 主分类号 H01L27/06
代理机构 代理人
主权项 1. An integrated circuit, comprising: a substrate including a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface configured to electrically connect the integrated circuit to a circuit board; a semiconductor die coupled to the second surface of the first substrate using a second set of electrical conductors; and a passive device dimensioned to be integrated with the integrated circuit, wherein the passive device is positioned between the second surface and at least one of the first set of electrical conductors, wherein the passive device comprises at least a third electrical conductor positioned on a first side of the passive device, wherein the passive device comprises at least a fourth electrical conductor positioned on a second side of the passive device, and wherein the second side of the device is positioned opposite the first side of the device; wherein the die is electrically connected to the fourth electrical conductor using the second set of electrical conductors and the third electrical conductor is available to be electrically connected to a second device using at least one of the first set of electrical conductors.
地址 Cupertino CA US