发明名称 レーザ加工装置、レーザ加工システム、レーザ加工方法
摘要 PROBLEM TO BE SOLVED: To solve a problem that in a processing device for injecting a water jet to a processing target and emitting a laser beam by using a stream of the water jet as a light guiding material to perform cutting, when cutting depth becomes long to some extent, the laser beam attenuates until reaching a processing point, causing limitation on cutting possible depth.SOLUTION: A stream is injected to form a first diameter on a processing target and cutting is performed. Subsequently, the stream is injected to form a second diameter (smaller than the first diameter) on the processed object and cutting is performed. This can suppress absorption of laser beam in a cut part side face.
申请公布号 JP6063635(B2) 申请公布日期 2017.01.18
申请号 JP20120089751 申请日期 2012.04.10
申请人 株式会社東芝 发明人 千田 格;椎原 克典;秋葉 美幸;廣田 圭一
分类号 B23K26/146;B23K26/00;B23K26/38 主分类号 B23K26/146
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