| 摘要 |
PROBLEM TO BE SOLVED: To provide a lid for a semiconductor package and a semiconductor package capable of allowing physical access to packaged components and correcting warp of a substrate.SOLUTION: There is provided a lid for a semiconductor package covering a substrate on which a semiconductor chip and other components are packaged. The lid comprises: a board material bonded to the substrate; a concave part formed on a surface on which the substrate of the board material is bonded and containing the semiconductor chip; and a through hole part formed so as to penetrate through both surfaces of the board material in a position different from a position of the concave portion and containing the other members. |
