| 摘要 |
The present invention relates to the production of buffered polymeric layers, for instance buffered dielectric layers. The invention provides a process for producing a buffered polymeric layer, which process comprises: (i) disposing on a substrate under reduced pressure a composition comprising a buffer compound, which buffer compound comprises: (a) a polymerizable group, P1, and (b) a non-polymerizable group, T; and (ii) curing the composition disposed on the substrate. The invention also provides a process for producing devices comprising a buffered polymeric layer. Buffered polymeric layers and devices comprising buffered polymeric layers are also provided. Devices according to the invention may be semiconductor devices, for instance transistors. |
