| 发明名称 |
SEMICONDUCTOR ASSEMBLIES WITH FLEXIBLE SUBSTRATES |
| 摘要 |
Embodiments of semiconductor assemblies, and related integrated circuit devices and techniques, are disclosed herein. In some embodiments, a semiconductor assembly may include a flexible substrate, a polycrystalline semiconductor material, and a polycrystalline dielectric disposed between and adjacent to the flexible substrate and the polycrystalline semiconductor material. The polycrystalline semiconductor material. The polycrystalline semiconductor material may include a polycrystalline III-V material, a polycrystalline II-VI material or polycrystalline germanium. Other embodiments may be disclosed and/or claimed. |
| 申请公布号 |
US2017011912(A1) |
申请公布日期 |
2017.01.12 |
| 申请号 |
US201415119683 |
申请日期 |
2014.03.18 |
| 申请人 |
INTEL CORPORATION |
发明人 |
MUKHERJEE Niloy;DOYLE Brian S.;RADOSAVLJEVIC Marko;PILLARISETTY Ravi;THEN Han Wui;RAO Valluri R.;CHAU Robert S. |
| 分类号 |
H01L21/02;H01L29/786;H01L27/12 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor assembly, comprising:
a flexible substrate; a polycrystalline semiconductor material comprising a polycrystalline III-V material, a polycrystalline II-VI material or polycrystalline germanium; and a polycrystalline dielectric disposed between and adjacent to the flexible substrate and the polycrystalline semiconductor material. |
| 地址 |
Santa Clara CA US |
