发明名称 |
POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE |
摘要 |
Disclose is a polyamide resin composition having excellent heat resistance, heat aging resistance and mechanical physical properties, which is produced by incorporating a specified aromatic secondary amine compound and a specified organic sulfur based compound into a polyamide composed of a diamine unit containing a paraxylylenediamine unit as a major component and a dicarboxylic acid unit containing a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms as a major component. |
申请公布号 |
EP2436733(B1) |
申请公布日期 |
2017.01.11 |
申请号 |
EP20100780658 |
申请日期 |
2010.05.28 |
申请人 |
Mitsubishi Gas Chemical Company, Inc. |
发明人 |
OGAWA, Shun;SUMINO, Takahiko |
分类号 |
C08L77/06;C08G69/26;C08K5/00;C08K5/18;C08K5/372;C08K5/378;C08K5/39 |
主分类号 |
C08L77/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|